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CT scan: Bonding wires that are difficult to observe with conventional measuring instruments.

Leave it to us for analyzing internal defects and creating 3D data!

Material: Printed Circuit Board Observation Range: 5 x 5 (mm) The image shows the condition when observing bonding wires. Bonding wires are thin metal wires used as connection materials in semiconductors. We have visualized issues such as joint defects and flow rate calculations, which are considered difficult to evaluate with standard measuring instruments. At Castem, we offer CT scan services using the Nikon MCT225. We can either hold your samples or allow you to scan them with our staff accompanying you. By performing a CT scan, it becomes possible to analyze internal defects, create 3D data, and measure internal dimensions. If you are interested, please feel free to contact us.

  • Non-destructive testing
  • Measurement and Inspection
  • Other measuring instruments

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